High-Temperature Silicon Carbide Ceramics 98% SiC 1650°C

Silicon Carbide Ceramics The Ultimate Material for High-Temperature Performance

Silica ceramic is a high-performance inorganic material primarily composed of silicon dioxide (SiO₂), valued for its exceptional thermal stability, low thermal expansion, and excellent dielectric properties. It serves critical roles in semiconductor, optical, and high-temperature applications where precision and reliability are paramount.

Key Characteristics

• Ultra-Low Thermal Expansion – Near-zero thermal expansion coefficient (∼0.55 × 10⁻⁶/°C for fused silica), ideal for precision optics and space telescopes.

• High Thermal Shock Resistance – Withstands rapid temperature changes (up to 1000°C quenching) due to low thermal conductivity.

• Optical Transparency – Fused silica transmits UV to IR wavelengths (∼180 nm to 2.5 μm), used in lenses and laser components.

• Chemical Inertness – Resists acids (except HF) and molten metals, suitable for crucibles and labware.

• Electrical Insulation – High resistivity (>10¹⁶ Ω·cm) and low dielectric loss at high frequencies.

Manufacturing Process

1. Raw Material Synthesis

   • High-purity SiO₂ from quartz sand (fused silica) or sol-gel-derived nanocolloids.

2. Forming

   • Sintering: Compacted SiO₂ powder fired at 1300–1500°C (vitreous silica lacks crystalline phases).

   • Casting/Molding: For transparent optics (e.g., UV-grade fused silica).

3. Post-Processing

   • Precision polishing for optical surfaces (Ra <1 nm).

   • Etching or coating (e.g., anti-reflective layers).

Applications

• Semiconductors: Wafer carriers, diffusion furnace tubes.

• Optics: Telescope mirrors, EUV lithography components.

• High-Tech: Radomes, fiber optic cladding.

• Energy: Crucibles for silicon ingot growth.

Silica ceramic bridges advanced technology and extreme environments, leveraging its unmatched stability.